Surface mount power supply device
US6289580A · kind A · utility
0Cited by
12References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 2, 1999 |
| Grant date | Sep 18, 2001 |
| Priority date | — |
| Expiry date | Feb 2, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49139
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method and apparatus for manufacturing a surface mount power supply device having effective thermal management. The surface mount power supply device comprises a printed circuit board mounted to a thermal plastic lead frame attach by means of vertically-extending aluminum pins embedded in the lead frame attach. A cylindrical member is centered within the lead frame attach by means of inwardly protruding arms transversely connected to the lead frame attach to allow for a pick-and-place operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.