Patent · US Expired

Multiple power interconnect arrangement for inkjet printhead

US6290333A · kind A · utility

30Cited by
29References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 29, 1999
Grant dateSep 18, 2001
Priority date
Expiry dateOct 29, 2019

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K1/118
  • WIPO fieldTextile and paper machines
  • WIPO sectorMechanical engineering

Abstract

An interconnection arrangement for an inkjet printing system having multiple power pads, each of which provides power for driving a large number of printhead ink ejection elements. The ink ejection elements of a print cartridge are organized into groups, with power provided to each group by one of the power pads. The firing pulse width of each group is independently set to compensate for the parasitic electrical resistances in the power path of each ink ejection group in the print cartridge so as to eject ink drops of uniform volume required for high quality printed output. In order to transmit the relatively high current levels required to fire a large number of ink ejection elements from a single group at the same time, the interconnection scheme provides multiple bump-and-dimple interconnections with the printer for each power and ground pad on the print cartridge.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.