Manufacturing method for a micromechanical device
US6290858A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 1999 |
| Grant date | Sep 18, 2001 |
| Priority date | — |
| Expiry date | Oct 13, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/0307
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A manufacturing method for a micromechanical device. In this method, a substrate is prepared with a plating base area to accommodate an anchoring region, and an adhesive layer is formed and structured on the substrate, so that the anchoring region is formed in the plating base area in the form of a quasi-insular region in a recess of the adhesive layer. The quasi-insular region is connected to the adhesive layer outside of the plated based area by at least one thin web. A mask is formed on the adhesive layer and structured so that the anchoring region and an overgrowth region adjacent to the anchoring region remain unmasked. An electroplated layer is deposited on the unmasked anchoring region so that the overgrowth region is overgrown, and the mask and the part of the adhesive layer that has not been overgrown are removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.