Patent · US Expired

Method and device for processing a flat workpiece, especially a semiconductor wafer

US6291261A · kind A · utility

1Cited by

3References

18Claims

0Family size

Assignee

ALPHASEM GmbH · CH

Inventors

Kurt Stark · Schaffhausen, CH
Markus Keller · Leonberg, DE

Key dates

Filing date	Apr 18, 2000
Grant date	Sep 18, 2001
Priority date	—
Expiry date	Apr 18, 2020

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/68785
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Semiconductor wafers are glued onto a carrier foil which is stretched across a frame. Instead of restretching the carrier foil directly at a processing machine, the foil is restretched on an adapter frame which can be stored and then later manipulated in the processing machine. The adapter frame includes a clamping ring, a base ring, and a threaded ring which secures the carrier foil.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.