Method for fabricating large area flexible electronics
US6291266A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 29, 2000 |
| Grant date | Sep 18, 2001 |
| Priority date | — |
| Expiry date | Nov 29, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for transferring of individual devices or circuit elements, fabricated on a semiconducting substrate, to a new substrate and placing said devices and elements in predetermined locations on the new substrate. The method comprises shaping the devices and circuits as truncated cones, lifting them off the original semiconducting substrates and depositing them en masse onto the new substrate, followed by their placing into receptors on the new substrate. The new substrate has preliminarily made receptors in a form of a truncated cone and the devices and circuits fill these receptors. Both the receptors and the devices and circuits have metallization contacts enabling to establish electrical contact between them. A method for real-time monitoring and verification of correctness of placement of the devices and circuits into the receptors by applying voltage pulse waveforms and measuring the resulting current pulse.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.