Abrasive finishing with partial organic boundary layer
US6291349A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 23, 2000 |
| Grant date | Sep 18, 2001 |
| Priority date | — |
| Expiry date | Mar 23, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of using a finishing element having a fixed abrasive finishing surface including organic boundary lubricants for finishing semiconductor wafers is described. The organic lubricants form an organic lubricating boundary layer in the operative finishing interface in a preferred coefficient of friction range. The selected coefficient of friction helps improve finishing and reduces unwanted surface defects. Differential lubricating boundary layer method are described to differentially finish semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer methods of finishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.