Compositions for the stripping of photoresists in the fabrication of integrated circuits
US6291410A · kind A · utility
1Cited by
4References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 24, 2000 |
| Grant date | Sep 18, 2001 |
| Priority date | — |
| Expiry date | Apr 24, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/426
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
For the stripping of photoresists, the invention proposes to use a mixture of dimethyl sulphoxide DMSO) or N-methylpyrrolidone (NMP) and 3-methoxypropylamine (MOPA). Advantageously, a little water and a corrosion inhibitor, such as sodium tolyltriazolate, are added to the mixture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.