Water sensitive hot melt adhesive
US6291562A · kind A · utility
1Cited by
9References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 19, 1996 |
| Grant date | Sep 18, 2001 |
| Priority date | — |
| Expiry date | Mar 19, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/28
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A water sensitive hot melt adhesive composition is described which possesses properties which are desirable with respect to the construction of disposable articles. The adhesive composition includes about 5% to about 95%, by weight, of a poly [vinyl methyl ether]; about 5% to about 70%, by weight, of a tackifying resin; and about 5% to about 35%, by weight, of a water soluble plasticizer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.