Process and arrangement for heat treatment of two-dimensional objects
US6291799A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2000 |
| Grant date | Sep 18, 2001 |
| Priority date | — |
| Expiry date | Jan 28, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a process for heat treatment of two-dimensional objects such as semiconductor wafers, for example in the form of silicon wafers, where the objects are arranged on supports and are conveyed through a heating unit, in particular continuously. To achieve a targeted treatment of a two-dimensional object, in particular of a semiconductor component such as a silicon wafer, on one side only, while at the same time achieving a high throughput with incorporation as necessary into a continuous overall manufacturing process, it is proposed that the objects be arranged in full surface contact with the supports, which cover the objects completely or almost completely on their underside and which in turn comprise quartz glass in particular.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.