Process for bonding workpieces
US6291806A · kind A · utility
9Cited by
38References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1999 |
| Grant date | Sep 18, 2001 |
| Priority date | — |
| Expiry date | Sep 30, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01D39/2048
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The process of bonding a first workpiece to a second workpiece is disclosed comprising the steps of fabricating a sintered bonding pad formed from a matrix of randomly oriented metallic fibers. The bonding pad is interposed between the first and the second workpiece and the first and second workpieces are biased into engagement with the bonding pad. Heat is applied to the first workpiece to the second workpiece for transforming substantially all of the metallic fibers into a liquid for bonding the first workpiece to the second workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.