Sensor package manufacture optimization
US6291818A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 1999 |
| Grant date | Sep 18, 2001 |
| Priority date | — |
| Expiry date | Mar 22, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N2201/02402
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In order to locate a package (110) which houses active elements including an opto-electric type transducer (100), in a position which assures that the opto-electric sensor and other active elements will be located in proper operative positions when the package is installed in predetermined piece of apparatus, the package casing (102) is provided with location features (112) at least some of which are deformable. During optimization, the package is moved with respect to a target until such time as the sensor is detected as producing an optimal output. Selected location features are then deformed to form location faces (112a) which have a predetermined spatial relationship with the active elements and which ensure that the active elements will be supported in an optimally operative position when the package is operatively disposed in a device such as an optical scanner or the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.