Semiconductor device including an integrally molded lead frame
US6291880A · kind A · utility
74Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 1999 |
| Grant date | Sep 18, 2001 |
| Priority date | — |
| Expiry date | Feb 10, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a main circuit part having a semiconductor device formed on an electrode plate of a lead frame and a control circuit part having protective functions, which is integrally molded by a resin mold part into an integral mold structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.