Functionally symmetric integrated circuit die
US6291896A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 16, 1999 |
| Grant date | Sep 18, 2001 |
| Priority date | — |
| Expiry date | Feb 16, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A functionally symmetric integrated circuit die to be mounted into a mutually symmetric receptor site. In one embodiment, a functionally symmetric integrated circuit die includes a substrate and a plurality of interface pads arranged thereon. The plurality of interface pads couple integrated circuitry disposed in the substrate to a plurality of interface pads of a mutually symmetric receptor site of an electronic device. The integrated circuit die can be mounted into the receptor site in any of a plurality of rotational orientations relative to the receptor site. The plurality of interface pads on the integrated circuit die and the receptor site are arranged such that an electronic device functions with the integrated circuit die in mounted in the receptor site in any one of the plurality of orientations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.