Equipment for holding a semiconductor wafer, a method for manufacturing the same, and a method for using the same
US6292346A · kind A · utility
13Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 20, 1999 |
| Grant date | Sep 18, 2001 |
| Priority date | — |
| Expiry date | Jul 20, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor wafer-holder having a member for holding the semiconductor wafer with a basic member made of a ceramic nitride, a cooling equipment made of a metal, and an intervened layer between the semiconductor wafer-holding member and the cooling equipment, the intervened layer being composed of a metallic foil or a carbon sheet having a thickness of not more than 500 .mu.m.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.