Method for producing foil circuit boards
US6293008A · kind A · utility
4Cited by
13References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2000 |
| Grant date | Sep 25, 2001 |
| Priority date | — |
| Expiry date | Jun 12, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1082
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for producing a foil circuit board including a plurality of flexible electrically non-conductive and flexible conductive layers, which are laminated together. The non-conductive layers are positioned between the conductive layers and two of the conductive layers are the outermost surface layers of the foil circuit board. The circuit board includes flexible areas and rigid areas, and the flexible areas are provided by etching the board to remove at least part of one of the outermost surface layers and an adjacent underlying non-conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.