Fixed abrasive finishing method using lubricants
US6293851A · kind A · utility
26Cited by
48References
51Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 5, 1999 |
| Grant date | Sep 25, 2001 |
| Priority date | — |
| Expiry date | Nov 5, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Fixed abrasive finishing method using lubricants A method of using a fixed abrasive finishing element method using lubricants for finishing semiconductor wafers is described. During the lubricating boundary layer thickness is controlled to improve finishing and reduce unwanted surface defects. Differential lubricating boundary layer methods are described to differentially finish semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer methods of finishing. Boundary layer lubricants recommended.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.