Polishing pads and methods relating thereto
US6293852A · kind A · utility
29Cited by
12References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2000 |
| Grant date | Sep 25, 2001 |
| Priority date | — |
| Expiry date | Nov 21, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D13/142
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The polishing pads of the present invention are formed by sintering or a combination of sintering and molding (including reaction injection molding). The polishing pads of the present invention are made of an advantageous hydrophilic polishing material and have a surface topography and texture which improves their polishing performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.