Abrasive silica compositions and dentifrice compositions prepared therefrom
US6294155A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 1998 |
| Grant date | Sep 25, 2001 |
| Priority date | — |
| Expiry date | Apr 8, 2018 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61K2800/412
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
Silica compositions for abrasive systems in dentifrice formulations are disclosed. The silica abrasive system comprises (a) silica gels having a median particle size below 7 microns, a pH of from about 6 to about 11 and powder RDA's of from 100 to about 200 and (b) silica gels or precipitates having a median particle size of 7 microns or greater and powder RDA's of from 50 to about 180. Silica (a) is preferably prepared by contacting a hydrous silica gel with an alkaline medium. Dentifrice compositions comprising the abrasive system has an RDA of 150 or less and PCR's of at least 80 and up to about 150, and an REA of less than about 30 (as measured on the IU scale).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.