Polyimide hybrid adhesives
US6294259A · kind A · utility
6Cited by
35References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2000 |
| Grant date | Sep 25, 2001 |
| Priority date | — |
| Expiry date | Jul 6, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to a polyimide hybrid adhesive comprised of an epoxy component, an epoxy curing agent, and a polyimide oligomer of molecular weight of up to about 8,000 (M.sub.n) having repeating units of Formula (1): ##STR1## The adhesives are particularly useful in applications where thermal stability and high adhesive strength are required.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.