Method for patterning devices

US6294398A · kind A · utility

Assignee

• THE TRUSTEES OF PRINCETON UNIVERSITY · US

Inventors

• Changsoon Kim · Princeton, US
• Paul E. Burrows · Chattaroy, US
• Stephen R. Forrest · Ann Arbor, US

Key dates

• Filing date: Nov 23, 1999
• Grant date: Sep 25, 2001
• Expiry date: Nov 23, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K71/221

Abstract

The present invention relates to patterning methods for organic devices, and more particularly to patterning methods using a die. The method includes depositing a first layer of organic materials over a substrate; depositing a second layer of an electrode material over the first layer of organic materials; pressing a patterned die having a raised portion onto the second layer; and removing the patterned die. Preferably the patterned die is coated with a metal. Optionally the method includes depositing additional layers over the substrate prior to pressing the patterned die.