Apparatus and method for adapting surface mount solder pad for heat sink function
US6294742A · kind A · utility
2Cited by
14References
34Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 27, 1999 |
| Grant date | Sep 25, 2001 |
| Priority date | — |
| Expiry date | Jul 27, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A surface mount solder pad that is adapted to function as a heat sink for an electronic component soldered to the pad. Included is a printed wiring board having solder pads disposed on its surface that are adapted for soldering to leads of surface mount components. The solder pads are electrically interconnected by conductive traces also disposed on the surface. At least one of the solder pads has an enhanced surface area that is selected larger than necessary for the soldering, and that is selected sufficiently large so as to sink enough heat generated by one of the surface mount components to provide for its proper operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.