Interconnection device
US6294966A · kind A · utility
11Cited by
7References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 31, 1999 |
| Grant date | Sep 25, 2001 |
| Priority date | — |
| Expiry date | Dec 31, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal vie and close proximity ground vies as well as tuned wire bonds are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.