Inverted board mounted electromechanical device
US6294971A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 12, 2001 |
| Grant date | Sep 25, 2001 |
| Priority date | — |
| Expiry date | Apr 12, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10477
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A new board mounted electromechanical device is provided that mounts to a relay substrate to form a low profile reed relay. The reed relay is electrically connected to the electrical contacts via a signal traces and additional electrical traces located on the same side of the relay substrate which connect to the relay's signal and shielding. Additional traces on both sides of the signal traces of the reed relay provide a co-planar wave guide to maintain the desired impedance of the signal path. The reed relay is mounted in an inverted manner into a cut-out in the main circuit board so that the other portion of the reed relay itself is sits within the cut-out in the main circuit board. As a result, the reed relay component is recessed below the surface of the main circuit board resulting in an overall low profile circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.