Heatsink for actively cooled daughterboard system
US6295202A · kind A · utility
20Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2000 |
| Grant date | Sep 25, 2001 |
| Priority date | — |
| Expiry date | Jun 29, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heatsink for use with an actively cooled daughterboard system. Plural transverse fins are integrally formed with a base portion. The fins are radially displaced from one another. The base portion includes a central portion that is thicker than the end portions. The thickness of the base portion and the profile formed by the outer ends of the fins vary according to radii. The inner radius associated with the central fins is shorter than the inner radius associated with the endmost fins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.