Method and device for simultaneously cutting off a multiplicity of wafers from a workpiece

US6295977A · kind A · utility

Assignees

• Wacker Chemie AG · DE
• Wacker Siltronic Gesellschaft Fur Halbleitermaterialien AG · DE

Inventors

• Bert Ripper · Postbauer-Heng, DE
• Christian Andrae · Tüßling, DE
• Karl Egglhuber · Hebertsfelden, DE
• Holger Lundt · Burghausen, DE
• Helmut Kolker · Hersbruck, DE
• Jochen Greim · Kempten (Allgäu), DE

Key dates

• Filing date: Nov 4, 1999
• Grant date: Oct 2, 2001
• Expiry date: Nov 4, 2019

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B28D5/045
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A method is for simultaneously cutting off a multiplicity of wafers from a hard, brittle workpiece which has a longitudinal axis and a peripheral surface. The workpiece is guided, by means of a translational relative movement, directed perpendicular to the longitudinal axis, between the workpiece and a wire web of a wire saw with the aid of a feed device, through the wire web which is formed by a sawing wire. The workpiece is rotated about the longitudinal axis while the wafers are being cut off. There is also a wire saw which is suitable for carrying out the method and has a device for holding and for rotating the workpiece about the longitudinal axis.