In-situ nano-interconnected circuit devices and method for making the same
US6297063A · kind A · utility
107Cited by
0References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 1999 |
| Grant date | Oct 2, 2001 |
| Priority date | — |
| Expiry date | Oct 25, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/932
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit device is disclosed comprising at least two circuit layers interconnected with a plurality of substantially equi-length nanowires disposed therebetween. The nanowires may comprise composites, e.g., having a heterojunction present along the length thereof, to provide for a variety of device applications. Also disclosed is a method for making the circuit device comprising growing a plurality of nanowires in-situ on at least one circuit substrate and then interconnecting the nanowires to a mating substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.