Method of fabrication of a microstructure having an internal cavity
US6297072A · kind A · utility
292Cited by
9References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 16, 1999 |
| Grant date | Oct 2, 2001 |
| Priority date | — |
| Expiry date | Apr 16, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01327
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of fabricating a microstructure having an inside cavity. The method includes depositing a first layer or a first stack of layers in a substantially closed geometric configuration on a first substrate. Then, performing an indent on the first layer or on the top layer of said first stack of layers. Then, depositing a second layer or a second stack of layers substantially with said substantially closed geometric configuration on a second substrate. Then, aligning and bonding said first substrate on said second substrate such that a microstructure having a cavity is formed according to said closed geometry configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.