Heat-setting single-component LVA (low viscosity adhesive) system for bonding in the micro-range

US6297344A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Klaus Höhn · Taufkirchen, DE
• Heiner Bayer · Olching, DE

Key dates

• Filing date: Jan 22, 1999
• Grant date: Oct 2, 2001
• Expiry date: Jan 22, 2019

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09J163/00
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A composition comprises from 60-98 weight percent of a casting resin such as an epoxy resin, from 2-30 weight percent of an alcohol or sugar such as 3 (4), 8 (9)-bis(hydroxymethyl)tricyclo[5.2.1.0.sup.2,6 ]decane, from 0.2 to 2.0 weight percent of a thermal initiator such as an onium salt, from 0.2-2.0 weight percent of a bonding agent such as 3-glycidyloxypropyltrimethoxysilane, from 0-3.0 weight percent of a flow improver, from 0.2-5.0 weight percent of a metal complex with an organic ligand such as an amino acid, acetate, carbonic acid, amine and acetylacetonate including zinc di-(2-ethylhexanoate) and from 0-4 weight percent of a thixotropic agent and/or a flow modifier.