Integrated circuit packages with improved EMI characteristics
US6297551A · kind A · utility
133Cited by
14References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 1999 |
| Grant date | Oct 2, 2001 |
| Priority date | — |
| Expiry date | Sep 22, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3442
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The specification describes a recessed chip MCM package with integrated electromagnetic shielding. The surfaces of the cavity which houses the IC devices are coated with metallization. The normally exposed top and side surfaces of the MCM package are also metallized. A solder wall is provided on the interconnect PCB which seals the gap between the MCM tile and the PCB interconnect substrate. The solder wall can be formed using standard solder bump technology, and the seal between the MCM and the PCB may be made during the same reflow operation that is used to flip-chip bond the MCM tile to the PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.