Memory module having improved heat dissipation and shielding
US6297966A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 1999 |
| Grant date | Oct 2, 2001 |
| Priority date | — |
| Expiry date | Sep 15, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A memory module assembly in accordance with the present invention comprises a memory module, such as a RAM module, and a pair of shells for enclosing the RAM module. The RAM module comprises a printed circuit board (PCB), a plurality of memory chips attached on the PCB and a plurality of related electronic elements disposed near the chips. A securing means comprises a clasp for fixing the PCB and the shells together at a middle portion proximate upper edges of the PCB and the shells, and a pair of rivets extending through corresponding positioning apertures defined proximate a bottom edge of the PCB and corresponding apertures defined proximate a bottom edge of the shell. The clasp is resilient and comprises a shoulder and a pair of resilient arms inwardly extending from opposite ends of the shoulder for securing the PCB and the shells together. The clasp can also integrally extend from an upper edge of each shell for being bent to secure the PCB and the shells together after the RAM module is assembled with the shells.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.