Method of bonding polymers and medical devices comprising materials bonded by said method
US6299596A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 4, 1998 |
| Grant date | Oct 9, 2001 |
| Priority date | — |
| Expiry date | Sep 4, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2383/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A method of bonding polymeric materials, in particular, polymeric materials comprising silicone, is provided along with medical devices comprising materials bonded together by said method. More specifically, the method of the present invention involves surface treating the surface of a polymeric material, preferably a polymeric material comprising silicone, such that the character of the surface of the material changes in a manner such that bondability of the material is enhanced. The surface of the surface treated polymeric material is then brought into contact with the surface of a second polymeric material and optionally, an adhesive, under conditions effective to bond the surfaces together. The bond so formed is stronger than a corresponding bond between untreated polymeric materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.