Cadmium-free silver alloy as low-melting brazing filler material

US6299835A · kind A · utility

Assignee

• Degussa AG · DE

Inventors

• Wolfgang Weise · Frankfurt, DE
• Willi Malikowski · Aschaffenburg, DE
• Dieter Kaufmann · Heidenheim, DE
• Harald Krappitz · Kirchheim unter Teck, DE

Key dates

• Filing date: Jul 12, 1994
• Grant date: Oct 9, 2001
• Expiry date: Jul 12, 2014

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/12896
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

Cadmium-free hard solders having working temperatures of less than 630.degree. C., which are easily workable and yield ductile soldered joints, are composed of 30 to 60% by weight of silver, 10 to 36% by weight of copper, 15 to 32% by weight of zinc, 0.5 to 7% by weight of gallium, 0.5 to 7% by weight of tin and 0 to 5% by weight of indium.