Integrated circuit device manufacture
US6300149A · kind A · utility
22Cited by
11References
29Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 5, 1999 |
| Grant date | Oct 9, 2001 |
| Priority date | — |
| Expiry date | Feb 5, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an integrated circuit device from a plurality of physically separate individual electrical elements comprises manufacturing each of the plurality of elements and verifying the operability of each of the elements. Inoperable elements are discarded and he operable elements retained in a fluid. The retained elements are aligned so that each element is adjacent to at least one other element and the arrangement of elements treated to provide connections therebetween and thereby to produce a single integrated circuit device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.