Process for fabricating micromechanical devices
US6300156A · kind A · utility
24Cited by
4References
13Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 7, 2000 |
| Grant date | Oct 9, 2001 |
| Priority date | — |
| Expiry date | Apr 7, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/924
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A process for fabricating a MEMS device is disclosed. The device has at least one hinged element. The MEMS device including the hinged element is delineated and defined on a semiconductor substrate. The substrate is placed device side down in a chamber. The MEMS device is then exposed to a release expedient for sufficient amount of time for the release expedient to dissolve a sacrificial material connecting the element to the substrate. Upon the dissolution of the sacrificial material, the element is released from the substrate and pivots away from the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.