Polishing compound and a method for polishing
US6300249A · kind A · utility
6Cited by
8References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 22, 1999 |
| Grant date | Oct 9, 2001 |
| Priority date | — |
| Expiry date | Apr 22, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention is a polishing compound comprising a colloidal solution containing 1.about.15 wt. % of silicon oxide particles of 8.about.500 nanometer average diameter, wherein said colloidal solution is prepared as a buffer solution which has buffering action between pH 8.7.about.10.6 by the addition of one combination selected from groups composed by weak acid and strong base, strong acid and weak base or weak acid and weak base, and logarithms of reciprocal number of acid dissociation constant at 25.degree. C. of said weak acid and/or weak base is 8.0.about.12.0.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.