Method and apparatus for machining an electrically conductive film
US6300594A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 1999 |
| Grant date | Oct 9, 2001 |
| Priority date | — |
| Expiry date | Feb 18, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/027
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for machining an electrically conductive film at a low cost, suitable for multi-product small-amount production are provided to reduce variations in resulting dimensions, a partially remaining conductive film, damage to an insulating substrate, and so on after machining, while eliminating the need for a waste liquid treatment. The apparatus includes a YAG laser for emitting near infrared light (at wavelength .lambda.=1064 nm), an optical system including a step index optical fiber for guiding the laser light emitted from the laser to the vicinity of an electrically conductive film on an insulating transparent substrate, an X-Y stage having a carrier for carrying the transparent substrate thereon, and a controller for controlling and driving the X-Y stage to move the transparent substrate in a direction orthogonal to a direction in which the laser light is irradiated. Instead of the optical fiber, a kaleidoscope may be used. The carrier can include a recess below at least a portion of the workpiece, which can be a touch panel or liquid crystal panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.