Solder paste and residue
US6300778A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 1999 |
| Grant date | Oct 9, 2001 |
| Priority date | — |
| Expiry date | Sep 8, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3485
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
This invention relates to an on-line statistical process control device for solder paste and residues. The invention consists of electronics hardware, software, and probing systems. The electrical hardware of the invention provides voltage and current measurements of solder paste materials, the software of the invention controls the hardware, provides real-time complex, non-linear least squares curve fitting for equivalent circuit analysis, data storage and retrieval of circuit parameters and behavior, and statistical process control tracking and charting. The probing systems of the invention allows for 2, 3, and 4 probe surface and bulk measurements of the solder paste and residues.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.