Isothermal heat sink with cross-flow openings between channels
US6301109A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2000 |
| Grant date | Oct 9, 2001 |
| Priority date | — |
| Expiry date | Feb 11, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Apparatus for cooling an electronic device, and a resultant fluid-cooled electronic apparatus are provided. In one embodiment, the apparatus includes a heat sink member with a surface for making thermal contact with the electronic device. The heat sink member has a plurality of channels for carrying coolant fluid. The plurality of channels are positioned in a first group and a second group such that coolant flow alternates across the member. At least one cross-flow opening is provided between at least some adjacent channels of the plurality of channels so that coolant flow can flow within the member between the first group of channels and the second group of channels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.