Permeation layer attachment chemistry and method

US6303082A · kind A · utility

Assignee

• Nanogen, Inc. · US

Inventors

• Havens R. John · San Diego, US
• Theodore Winger · San Diego, US
• Jain Krotz · San Diego, US
• Smolko Dan · Jamul, US
• Thomas J. Onofrey · San Marcos, US

Key dates

• Filing date: Dec 15, 1999
• Grant date: Oct 16, 2001
• Expiry date: Dec 15, 2019

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C40B40/10
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Electronically addressable microchips having covalently bound permeation layers and methods of making such covalently bonded permeation layers to microchips are provided. The covalent bonding is derived from combining the use of electrodes with silane derivatives. Such chemistry provides the ability to apply an electronic bias to the electrodes of the microchip while preventing permeation layer delaminating from the electrode surface.