Form-in-place EMI gaskets
US6303180A · kind A · utility
19Cited by
48References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 1997 |
| Grant date | Oct 16, 2001 |
| Priority date | — |
| Expiry date | Sep 18, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/26
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A form-in-place, electrically-conductive gasket is disclosed. The gasket, foamed, gelled or unfoamed is made of one or more elastomer resins, such as silicone urethane and/or thermoplastic block copolymers and is either filled with a conductive filler and lined onto a desired substrate or lined onto the substrate unfilled and then coated with a conductive outer layer, such as a silver filled elastomer or a conductive flocked layer. A process and system for making the gaskets are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.