Methods for separating microcircuit dies from wafers
US6303409A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 1999 |
| Grant date | Oct 16, 2001 |
| Priority date | — |
| Expiry date | Dec 8, 2019 |
Classification
- Technology area (CPC —)General
Abstract
Methods are provided for separating microcircuit dies from a wafer, which includes microcircuit dies containing componentry on a circuit side thereof and streets separating the dies from each other. A first wafer mount film is affixed to the circuit side of the wafer, and the dies are detached along the streets with the circuit side of the wafer fixed to the first wafer mount film, thereby forming a divided wafer. A second wafer mount film is fixed to the back side of the divided wafer, and the first wafer mount film is removed from the divided wafer so that the dies remain fixed to the second wafer mount film with their circuit sides exposed. The second wafer mount film preferably has greater adhesion to the divided wafer than the first wafer mount film when the first wafer mount film is removed from the divided wafer. The first wafer mount film may comprise a protective film having holes aligned with fragile components on the dies and a cover film that covers the holes. The protective film may be an ultraviolet-curable film that exhibits reduced adhesion to the divided wafer after exposure to ultraviolet radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.