Process for physical isolation of regions of a substrate board
US6303462A · kind A · utility
13Cited by
4References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 19, 1999 |
| Grant date | Oct 16, 2001 |
| Priority date | — |
| Expiry date | Aug 19, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Process for physical isolation of regions (110) of a substrate board (100) comprising the following steps: PA1 a) formation of trenches (106) in the substrate, delimiting regions of the substrate (110), PA1 b) placement of a liquid bonding material (120) in the trenches, which can solidify and bond to the substrate board (100) when in the solid state, PA1 c) solidification of the bonding material. Application to isolation of electronic, optical, mechanical or magnetic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.