Method of manufacturing semiconductor device having reinforcing member and method of manufacturing IC card using the device
US6303471A · kind A · utility
17Cited by
10References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 1999 |
| Grant date | Oct 16, 2001 |
| Priority date | — |
| Expiry date | Oct 12, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/222
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
After a reinforcing plate is bonded to the lower surface of a semiconductor substrate having a major surface on which integrated circuits are formed, the reinforcing plate is cut in units of integrated circuit chips. A reinforcing member is formed from the reinforcing plate bonded to the lower surface of each integrated circuit chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.