Shingle circuits for thermophotovoltaic systems
US6303853A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2000 |
| Grant date | Oct 16, 2001 |
| Priority date | — |
| Expiry date | Feb 17, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A shingle circuit array and a method of assembling the shingle circuit is provided. The array has a shingle circuit with a substrate, an insulation film layer, a metal layer and TPV cells connected to the metal layer in series forming a shingle pattern with terraces. The substrate is of CTE matched material. The metal layer may be copper pads deposited on the terraces. The TPV cells are bonded to the copper pads and may be GaSb cells. Substrate materials include AlSiC or a Cu/Invar/Cu laminate sheet. The AlSiC material may be a microstructure having a continuous Al-metal phase with a discrete SiC particulate phase. The substrate may also be an enameled cast-iron substrate. The shingle circuit array may be provided in a TPV generator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.