Electronic part module and process for manufacturing the same
US6303873A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 1998 |
| Grant date | Oct 16, 2001 |
| Priority date | — |
| Expiry date | Apr 29, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3431
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An inexpensive electronic part module and a process for manufacturing the same, wherein an inexpensive thermoplastic resin is used as the substrate of the circuit board. In order to electrically connect the solder bumps of an electronic part such as an IC chip to a connection pattern, without forming connection holes in the substrate, the substrate is melted and the solder bumps are passed through the substrate by pressing the electronic part against the substrate in a state that the electronic part is heated. The substrate itself can be utilized as an adhesive. The solder bumps 2 are passed through the substrate 4 and contacted with the connection pattern 5 by pressing the solder bumps 2 against the substrate 4 in a state that the electronic part 3 is heated to a temperature higher than the melting point of the thermoplastic resin and lower than the melting point of the solder bumps 2. Further, the solder bumps 2 are melted and connected to the connection pattern 5 while the electronic part 3 is heated to a temperature higher than the melting point of the solder bumps 2. Accordingly, the electronic part 3 can be bonded and fixed at the periphery of the solder bumps 2 through the t…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.