Mounting structure of electronic component on substrate board
US6303878A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 1998 |
| Grant date | Oct 16, 2001 |
| Priority date | — |
| Expiry date | Jul 23, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A BGA package is mounted on a multi-layer printed wiring board having a plurality of electrodes arranged in a matrix form through a plurality of solder bumps. In the most externally-located electrodes, a lead wire is formed to extend from a portion of the most-externally-located electrode located inside of a polygon formed by connecting each of the centers of adjacent most-externally-located electrodes. Therefore, the solder bumps are prevented from coming off the most-externally-located electrodes because a portion of the most-externally-located electrode to which stress caused by an external shock is intensively applied is located in an outside of the polygon. Thus, a contact failure between the BGA package and the multi-layer printed wiring board is prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.