Semiconductor device comprising silicone adhesive sheet
US6304000A · kind A · utility
64Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2000 |
| Grant date | Oct 16, 2001 |
| Priority date | — |
| Expiry date | Nov 6, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprising a semiconductor chip, a semiconductor chip attachment site facing the semiconductor chip, and an adhesive silicone sheet bonding the semiconductor chip to the chip attachment site, wherein at least the surfaces of the sheet that connect the semiconductor chip and chip attachment site are a semi-cured product of a curable silicone composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.