Actively cooled daughterboard system
US6304442A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2000 |
| Grant date | Oct 16, 2001 |
| Priority date | — |
| Expiry date | Jun 29, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An actively cooled daughterboard system. One more daughterboards are mounted in parallel rows on a motherboard. Each daughterboard is oriented substantially perpendicular to the motherboard, but may optionally be mounted at an oblique angle relative to the motherboard. Each daughterboard has a low-profile thermally-efficient heatsink mounted thereon. A fan shroud partially covers the daughterboards, but has openings in its sides for directing air flow through plural fins on the heatsinks and through a fan mounted to the top of the fan shroud. The inventive daughterboard system enables multiple high heat dissipating daughterboards to be placed closer together than the daughterboard systems of the prior art while still keeping the daughterboards adequately cooled. Moreover, because only a single fan is used to cool all of the daughterboards under the shroud, noise and expense are reduced relative to prior art systems that employed one or more fans per daughterboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.