High density optoelectronic transceiver module
US6305848A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 19, 2000 |
| Grant date | Oct 23, 2001 |
| Priority date | — |
| Expiry date | Jun 19, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4249
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A high-density blindmate optoelectronic module is provided. The high-density module is adapted to mount on a removable printed circuit board which is configured to be inserted into a printed circuit board support rack located within a chassis based network element. The high-density module is configured to blindmate with a multi-fiber optical connector mounted within the chassis based network element. The high-density blindmate optoelectronic module is formed of a transceiver mounting block which supports a plurality of connectorized optical sub-assemblies. Each connectorized optical sub-assembly includes a plurality of optical transmitters, optical receivers, or a combination of optical transmitters and optical receivers. The optical transmitters and/or receivers define optical axes that extend through a first side of connectorized optical sub-assemblies. The high-density blindmate optoelectronic module includes circuitry for driving the optical transmitters and processing optical signals received by the optical receivers. An electrical interface is provided for transferring signals between the transceiver module and the removable printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.