Article comprising oxide-bondable solder
US6306516A · kind A · utility
14Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 1999 |
| Grant date | Oct 23, 2001 |
| Priority date | — |
| Expiry date | Dec 17, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S228/903
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention provides an article comprising a solder that bonds well to oxides and other surfaces to which solder bonding is problematic. The solder composition contains one or more rare earth elements, which react with the oxide or other surface to promote bonding, and further contains sufficient Au and/or Ag to act as carriers for the rare earths. Because rare earths have some solid solubility in Au and Ag, the problem of intermetallic formation is lessened or eliminated, and improved bonding to oxide surfaces is attained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.